Thermal simulator

ABSTRACT

A thermal simulator simulates the thermal behavior of items such as eggs for which the actual internal temperature profile is difficult to measure. A yolk body simulates the egg yolk, an albumen body surrounds the yolk body and simulates the egg albumen, and a shell layer surrounds the albumen body to simulate the shell. The thermal properties of the materials forming the egg body, albumen body and shell layer are tuned to match the thermal properties of the egg yolk, egg albumen and egg shell. Thermometric devices are positioned within the egg body and egg albumen along with communication devices which process signals from the thermometric devices indicative of temperature and communicate these signals to a computer for further processing and display.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 13/920,165, filed Jun. 18, 2013, the contents of which areincorporated by reference herein in its entirety.

FIELD OF THE INVENTION

This invention concerns devices for simulating the thermalcharacteristics of items for which direct measurement of the item'sinternal temperature is difficult.

BACKGROUND

Federal mandates passed in 2009 require whole shell egg producers totake numerous precautions to help prevent Salmonella enterica serovarEnteritidis in egg laying flocks. The Food and Drug Administration (FDA)reports as many as 79,000 illnesses and 30 deaths could be preventedeach year if such precautions are implemented. The FDA mandates requireperiodic Salmonella testing, cleaning and sanitizing of positive houses,and impose protocols for preventing the introduction and spread ofbacteria, pest control, as well as protocols for workers and equipment.Additional record keeping requirements are also part of the mandates.

However, these mandates are not required if the eggs are subjected to apasteurization process before they are sold to consumers. While severalprocedures using different techniques exist, such as microwave, radiowave, ozone, and basic convective heat treatments for pasteurizing wholeshell eggs, only one of the methods is used commercially in the UnitedStates today. Although these decontamination processes varysignificantly, all rely on heating the eggs, either fully or partially,to ensure proper reduction of the Salmonella population.

An example pasteurization process reveals some of the complicationsassociated with methods that primarily use heat. The heat of thepasteurization process partially denatures egg proteins and changes thefunctionality of raw egg components. Lack of effective temperaturemonitoring and control increases the severity of these changes. Eggprocessors need to ensure that the thermal treatment is stringent enoughto eliminate internal egg pathogens without causing thermal damage toegg components. Therefore, there is a need to accurately measure andpromptly report internal egg temperature during the heating process.Current techniques to monitor an egg's internal temperature arecumbersome and often produce inconsistent results. Indirect methods ofprocess control include regulating the temperature of a water bath inwhich the eggs are heated and regulating the time which the eggs spendin the bath. However, even these measurements are usually derived fromthose taken previously from the egg itself and are thus less thanreliable.

Currently, the thermal processing of eggs is monitored usingtechnologies developed for the canning industry. An example of thisconventional temperature monitoring involves using thermocouplesinserted inside the coldest spot of a number of test eggs, and locatingthe test eggs in the least-heated position in the apparatus heating theeggs, such as a water bath. Long wires transmit thermocouple signalsfrom test eggs to signal reading devices and a data processing systemlocated outside of the water bath. The data processing system amplifiesthe thermocouple signals, an analog-to-digital converter digitizes thesignals, and computer software transforms the digitized signals to atemperature-time matrix.

Measuring internal egg temperature involves positioning a thermocouplein egg's coldest spot, which is an imprecise exercise. The egg shell issolid layer that is suitable for protecting potentially developingembryo. The shell keeps fluid parts in and extraneous substances out.Because the shell is made of a brittle porous material, inserting atemperature probe into the egg without cracking it is an art that takestime and many failures to master. Once inserted, the shell is not strongenough to reliably maintain the orientation of the probe or its positioninside the egg. Therefore, a device is needed to hold the egg andtemperature probe in the desired orientation and relative position.Consistency of probe orientation and position is also crucial. Thecenter of the yolk heats much more slowly than the region at itsboundary with the albumen just outside the yolk. Inconsistency oftemperature probe position can produce errors that would adverselyaffect process lethality or product quality.

There is clearly a need for a device which can replace the use of actualeggs to monitor and control the internal temperature of eggs subjectedto pasteurization processes.

SUMMARY

One example concept of the invention concerns a thermal simulator for anegg having a yolk, an albumen layer and a shell. In one exampleembodiment, the thermal simulator comprises a yolk body simulating theyolk. An albumen body simulating the albumen surrounds the yolk body. Ashell layer may surround the albumen body. The shell layer simulates theshell. A first thermometric device is positioned within either the yolkbody or the albumen body. A first communication device is positionedwithin one of the yolk body or the albumen body for transmitting a firsttemperature, measured within either the yolk body or the albumen body,by the first thermometric device, to a position outside of the shelllayer.

In a particular example embodiment, the first thermometric device andthe first communication device are positioned within the yolk body. Inthis example, the thermal simulator further comprises a secondthermometric device positioned within the albumen body. A secondcommunication device is positioned within the albumen body fortransmitting a second temperature, measured within the albumen body bythe second thermometric device, to a position outside of the thermalsimulator.

In order to simulate the yolk, the yolk body comprises a material havinga thermal diffusivity from about 1.1E-07 to about 1.4E-07 m²/s. In aspecific example embodiment, the yolk body comprises a material having athermal diffusivity of about 1.3E-07. In order to simulate the yolk, theyolk body comprises a material having a heat capacity from about 1000 toabout 4000 J/(kg*K). In a specific example embodiment, the yolk bodycomprises a material having a heat capacity of about 2700 J/(kg*K). Inorder to simulate the albumen, the albumen body comprises a materialhaving a thermal diffusivity from about 1.3E-07 to about 2.3E-07 m²/s.In a specific example embodiment, the albumen body comprises a materialhaving a thermal diffusivity of about 2.2E-07 m²/s. In order to simulatethe albumen, the albumen body comprises a material having a heatcapacity from about 500 to about 4000 J/(kg*K). In a specific exampleembodiment, the albumen body comprises a material having a heat capacityof about 2900 J/(kg*K). In order to simulate the shell, the shell layercomprises a material having a thermal diffusivity from about 7.0E-08 toabout 7.0E-06 m²/s. In a specific example embodiment, the shell layercomprises a material having a thermal diffusivity of about 7.6E-07 m²/s.In order to simulate the shell, the shell layer comprises a materialhaving a heat capacity from about 500 to about 2000 J/(kg*K). In aspecific example embodiment, the shell layer comprises a material havinga heat capacity of about 910 J/(kg*K). In order to simulate the yolk,the yolk body comprises a material having a density from about 700 toabout 4000 kg/m³. In a specific example embodiment, the yolk bodycomprises a material having a density of about 1100 kg/m³. In order tosimulate the albumen, the albumen body comprises a material having adensity from about 700 to about 4000 kg/m³. In a specific exampleembodiment, the albumen body comprises a material having a density ofabout 1000 kg/m³. In order to simulate the shell, the shell layercomprises a material having a density from about 1000 to about 3000kg/m³. In a specific example embodiment, the shell layer comprises amaterial having a density of about 2100 kg/m³. In order to simulate theyolk, the yolk body comprises a material having a thermal conductivityfrom about 0.2 to about 0.6 W/(m*K). In a specific example embodiment,the yolk body comprises a material having a thermal conductivity ofabout 0.4 W/(m*K). In order to simulate the albumen, the albumen bodycomprises a material having a thermal conductivity from about 0.1 toabout 0.9 W/(m*K). In a specific example embodiment, the albumen bodycomprises a material having a thermal conductivity of about 0.6 W/(m*K).In order to simulate the shell, the shell layer comprises a materialhaving a thermal conductivity from about 0.15 to about 2.0 W/(m*K). In aspecific example embodiment, the shell layer comprises a material havinga thermal conductivity of about 1.5 W/(m*K).

By way of example, the yolk body may comprise a polyamide, the albumenbody may comprise epoxy and the shell layer may comprisepolytetrafluoroethylene. The yolk body may comprise metal particles orcarbon based particles to increase its thermal conductivity, or it maycomprise ceramic particles to decrease its thermal conductivity.Similarly, the albumen body may comprise metal particles or carbon basedparticles to increase its thermal conductivity or it may compriseceramic particles to decrease its thermal conductivity.

In an example embodiments, the thermometric devices may comprisecapacitive sensors piezo-resistive sensors, vibration based sensors andthermocouples.

In a particular example embodiment, the first communication devicecomprises transduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the first communication device compriseselectrical conductors extending from the first thermometric device tothe position outside of the thermal simulator.

In a particular example embodiment, the second communication devicecomprise transduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother embodiment, the second communication device comprises electricalconductors extending from the first thermometric device to the positionoutside of the thermal simulator.

By way of example, a plurality of first thermometric devices may bepositioned within the yolk body and/or within the albumen body.

Another example concept of the thermal simulator comprises a first bodyformed of a first material. The first material has a first heatcapacity, a first density, and a first thermal conductivity. A firstthermometric device is positioned within the first body. A firstcommunication device for transmitting a first temperature, measuredwithin the first body by the first thermometric device, to a positionoutside of the first body is positioned within the first body. In aparticular example embodiment, the first communication device comprisestransduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the first communication device comprises anelectrical conductor extending from the first thermometric devicethrough the first body. By way of example, the first thermometric devicemay comprise a capacitive sensor. In another example embodiment, thefirst thermometric device may comprise a thermocouple.

By way of example, the thermal simulator may further comprise a secondbody surrounding the first body. The second body is formed of a secondmaterial. The second material has a second heat capacity, a seconddensity, and a second thermal conductivity. A second thermometric devicemay be positioned within the second body. A second communication devicefor transmitting a second temperature, measured within the second bodyby the second thermometric device, to a position outside of the secondbody, may also be positioned within the second body.

In a particular example embodiment, the first and second bodies are incontact with one another. By way of example, the second material may bedifferent from the first material. By way of further example, at leastone of the second heat capacity, the second density, and the secondthermal conductivity is different from the first heat capacity, thefirst density, and the first thermal conductivity respectively.

In a particular example embodiment, the second communication devicecomprises transduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the second communication device comprises anelectrical conductor extending from the second thermometric devicethrough the second body.

By way of example, the thermal simulator may further comprise a thirdbody surrounding the second body. The third body is formed of a thirdmaterial. The third material has a third heat capacity, a third density,and a third thermal conductivity. A third thermometric device may bepositioned within the third body. A third communication device fortransmitting a third temperature, measured within the third body by thethird thermometric device, to a position outside of the third body mayalso be positioned within the third body.

In a particular example embodiment, the second and third bodies are incontact with one another. By way of example, the third material may bedifferent from the second material. In an example embodiment, at leastone of the third heat capacity, the third density, and the third thermalconductivity is different from the second heat capacity, the seconddensity, and the second thermal conductivity respectively.

In a particular example embodiment, the third communication devicecomprises transduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the third communication device comprises anelectrical conductor extending from the third thermometric devicethrough the third body.

In another example concept, the thermal simulator comprises a firstsubstrate formed of a first material, the first material having a firstheat capacity, a first density, and a first thermal conductivity. Afirst thermometric device is positioned within the first substrate. Afirst communication device for transmitting a first temperature,measured within the first substrate by the first thermometric device, toa position outside of the first substrate is also positioned within thefirst substrate.

In a particular example embodiment, the first communication devicecomprises transduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the first communication device comprises anelectrical conductor extending from the first thermometric devicethrough the first substrate.

By way of example, the first thermometric device may comprise acapacitive sensor. In another example embodiment, the first thermometricdevice comprises a thermocouple.

By way of example, the thermal simulator may further comprise a secondsubstrate overlying the first substrate. The second substrate is formedof a second material. The second material has a second heat capacity, asecond density, and a second thermal conductivity. A second thermometricdevice may be positioned within the second substrate. A secondcommunication device for transmitting a second temperature, measuredwithin the second substrate by the second thermometric device, to aposition outside of the second substrate may also be positioned withinthe second substrate.

In a particular example embodiment, the first and second substrates arein contact with one another. In another example embodiment, the secondmaterial is different from the first material. By way of furtherexample, at least one of the second heat capacity, the second density,and the second thermal conductivity is different from the first heatcapacity, the first density, and the first thermal conductivityrespectively.

In an example embodiment, the second communication device comprisestransduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the second communication device comprises anelectrical conductor extending from the second thermometric devicethrough the second substrate.

By way of example, the thermal simulator may further comprise a thirdsubstrate overlying the second substrate. The third substrate is formedof a third material. The third material has a third heat capacity, athird density, and a third thermal conductivity. A third thermometricdevice may be positioned within the third substrate. A thirdcommunication device for transmitting a third temperature, measuredwithin the third substrate by the third thermometric device, to aposition outside of the third substrate may also be positioned withinthe third substrate.

In a particular example embodiment, the second and third substrates arein contact with one another. By way of example, the third material maybe different from the second material. In a further example, at leastone of the third heat capacity, the third density, and the third thermalconductivity is different from the second heat capacity, the seconddensity, and the second thermal conductivity respectively.

In an example embodiment, the third communication device comprisestransduction and signal processing circuitry for converting atemperature measurement into an electric signal, a radio frequencyantenna and radio transmitter circuitry for transmitting the electricsignal, and an energy storage unit for powering the circuitry. Inanother example embodiment, the third communication device comprises anelectrical conductor extending from the third thermometric devicethrough the third substrate.

The invention further comprises another embodiment of a thermalsimulator. By way of example, the thermal simulator comprises a shelllayer defining an enclosed volume. The shell layer has an inner surfacefacing the enclosed volume. A first thermometric device is positionedwithin the enclosed volume. A first communication device is alsopositioned within the enclosed volume for transmitting a firsttemperature, measured within the enclosed volume by the firstthermometric device, to a position outside of the shell layer. A supportstructure is positioned between the inner surface of the shell layer andthe first thermometric device for fixing the first thermometric deviceat a desired position within the enclosed volume.

In one example embodiment, the first thermometric device is positionedat a center of the enclosed volume. An example thermal simulator mayfurther comprise a second thermometric device positioned within theenclosed volume. A second communication device may also be positionedwithin the enclosed volume for transmitting a second temperature,measured within the enclosed volume by the second thermometric device,to a position outside of the shell layer. The second thermometric devicemay be attached to the inner surface of the shell layer, for example.

In one example thermal simulator, the enclosed volume contains a gas.The gas may comprise air for example. In another example embodiment, theenclosed volume contains a liquid. In yet another example embodiment,the enclosed volume comprises at least a partial vacuum.

In one example embodiment, the support structure comprises at least onestrut extending between the inner surface and the first thermometricdevice. The at least one strut conducts heat from the shell layer to thefirst thermometric device at a desired rate. In another exampleembodiment, the support structure may comprise a plurality of wiresextending between the shell layer and the first thermometric device, thewires being adapted to conduct heat from the shell to the firstthermometric device at a desire rate.

By way of example, the communication devices may comprise transductionand signal processing circuitry for converting a temperature measurementinto an electric signal, a radio frequency antenna and radio transmittercircuitry for transmitting the electric signal, and an energy storageunit for powering the circuitry. In another example embodiment, thecommunication devices may comprise an electrical conductor extendingfrom the first thermometric device through the shell layer. In apractical example, the thermometric devices may comprise a sensorselected from the group consisting of capacitive sensors,piezo-resistive sensors, vibration based sensors and thermocouples.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric partial sectional view of an example embodimentof a thermal simulator according to the invention;

FIG. 2 is an exploded schematic isometric view of a combinationthermometric device and communication device used with the thermalsimulator of FIG. 1;

FIG. 3 is an isometric partial sectional view of another exampleembodiment of a thermal simulator according to the invention;

FIG. 4 is an isometric partial sectional view of another exampleembodiment of a thermal simulator according to the invention;

FIG. 5 is an isometric schematic view of another example embodiment of athermal simulator according to the invention; and

FIGS. 6-8 are cross sectional views of example embodiments of otherexample embodiments of thermal simulators according to the invention.

DETAILED DESCRIPTION

One object of the invention is to provide a device which simulates thethermal behavior of an egg having a yolk, an albumen layer and a shell.The egg thermal simulator disclosed herein is used to predict thetemperature distribution within an egg by measuring the temperaturedistribution within the egg thermal simulator when both the egg and eggthermal simulator are subjected to the same thermal environment. Use ofsuch a simulator, for example, will allow a heat treatment processintended to sterilize the eggs, to be monitored and controlled forefficacy.

FIG. 1 shows an example thermal simulator 10 for an egg having a yolk,an albumen layer and a shell. Thermal simulator 10 comprises a yolk body12 simulating the thermal characteristics of the egg's yolk. Yolk body12 is surrounded by an albumen body 14 simulating the thermalcharacteristics of the egg's albumen layer. An optional shell layer 16may surround the albumen body, the shell layer simulating the thermalcharacteristics of the egg's shell.

The primary parameter necessary to effectively simulate the thermalcharacteristics of the egg's yolk, albumen layer and shell is thethermal diffusivity. The heat capacity, the density, and the thermalconductivity of the yolk, albumen layer and shell also play an importantpart in the simulation. To that end, the yolk body 12 is formed from amaterial having a thermal diffusivity, heat capacity, density andthermal conductivity matched as closely as possible to that of the egg'syolk. It is expected that a yolk body 12 formed from a material having athermal diffusivity from about 1.1 E-07 to about 1.4E-07 m²/s, a heatcapacity from about 1000 to about 4000 J/(kg*K), a density from about700 to about 4000 kg/m³, and a thermal conductivity from about 0.2 toabout 0.6 W/(m*K) will behave similarly to an egg's yolk so as toprovide acceptable predictions of the actual temperature within the eggto which the simulator is matched. Mathematical models predict thatpolyamide material, specifically Polyamide 610 having a thermaldiffusivity of about 1.26E-07 m²/s, a heat capacity of about 1700J/(kg*K), a density of about 1075 kg/m³, and a thermal conductivity ofabout 0.23 provide useful results when used to form the yolk body 12.

Similarly, the material for the albumen body 14 is selected so as tomatch, as closely as possible, the heat capacity, density, and thermalconductivity of the egg's albumen layer. It is expected that a albumenbody 14 formed from a material having a thermal diffusivity from about1.3E-07 to about 2.3E-07 m²/s, a heat capacity from about 500 to about4000 J/(kg*K), a density from about 700 to about 4000 kg/m³, and athermal conductivity from about 0.1 to about 0.9 W/(m*K) will behavesimilarly to an egg's albumen so as to provide acceptable predictions ofthe actual temperature within the egg to which the simulator is matched.Mathematical models predict that epoxy, specifically diglycidyl ethertype epoxy, having a thermal diffusivity of about 2.25E-07 m²/s, a heatcapacity of about 636 J/(kg*K), a density of about 1170 kg/m³, and athermal conductivity of about 0.17 W/(m*K) provides useful results whenused to form the albumen body. Silicone gel may also be used as thealbumen body 14. The viscous nature of the gel will allow the viscousproperties of the albumen layer to be simulated, thus capturing theeffects of heat transfer by convection. Note that the shell layer 16will be used to enclose and contain the albumen body 14 when viscousmaterials, such as silicone gels are used.

The egg's shell may also have a measurable effect on the heat transfercharacteristics of the egg. Therefore, it is advantageous to select amaterial for the shell layer 16 matching, as closely as possible, thethermal diffusivity, heat capacity, density, and thermal conductivity ofthe egg's shell. It is expected that a shell layer 16 formed from amaterial having a thermal diffusivity from about 7E-08 to about 7E-06m²/s, a heat capacity from about 500 to about 2000 J/(kg*K), a densityfrom about 1000 to about 3000 kg/m³, and a thermal conductivity fromabout 0.15 to about 2 W/m*K) will behave similarly to an egg's shell soas to provide acceptable predictions of the actual temperature withinthe egg to which the simulator is matched. It is further predicted thatpolytetrafluoroethylene (Teflon), having a thermal diffusivity of about1.1E-07 m²/s, a heat capacity of about 1000 J/(kg*K), a density of about2280 kg/m³, and a conductivity of about 0.25 W/(m*K) will be anacceptable material for the shell layer as it would provide protectionfor the lesser chemically resistant thermal components.

It is recognized that it may not be possible to select materials havingthe characteristics of heat capacity, density and thermal conductivitywhich will provide an acceptable match to those of the egg's yolk,albumen layer and shell. However, it is possible to modify the materialcharacteristics and achieve a thermal simulator which will provideresults that correlate well with measurements taken using eggs. Forexample, particles 18 may be added to the albumen body 14 and/or theyolk body which increase their thermal conductivity. Candidate materialscomprising particles 18 used primarily to increase the thermalconductivity of the body in which they are placed include metals such asstainless steel, steel, nickel, copper, iron, aluminum as well as othermetals and metal alloys. Carbon materials such as graphite, graphene,carbon nano-tubes and carbides may also comprise particles 18 whichincrease the thermal conductivity. Likewise, particles 20 may be addedto the albumen body 14 and/or the yolk body 12 to decrease the thermalconductivity of the albumen and yolk bodies. Candidate materialsinclude, for example, ceramics. Particles 18 and 20 may further be usedin combination to tune the thermal conductivity of a body. Density andheat capacity will also be affected by the presence of the particles 18and 20. Mathematical models predict that an albumen body 14 comprised ofepoxy with 40% stainless steel particle filler will match thecharacteristics of an egg's albumen layer and yield acceptablepredictions for the temperature distribution throughout an egg.Mathematical models have also been developed which predict that epoxywith 30% nickel particle filler will adequately simulate an egg'salbumen layer.

The emphasis on matching the relevant material characteristics of anegg's yolk, albumen layer and shell with those of the thermalsimulator's yolk body 12, albumen body 14 and shell layer 16 resultsfrom the desire for the thermal simulator to have the same approximatesize, shape and weight of the egg which it models. Similarity of size,shape and weight between the thermal simulator 10 and an egg isadvantageous because such a simulator will be compatible with existingegg processing equipment such as conveyors, holding racks, water baths,sterilizers and the like. Use of a simulator which closely matches thephysical size, shape and weight of an egg would therefore avoid the needto modify the egg processing equipment, which would treat the thermalsimulator 10 exactly like the rest of the eggs being processed. However,it is recognized that tuning of the thermal simulator's relevantcharacteristics of heat capacity, density and thermal conductivity mayalso be achieved by varying the size and shape of the yolk body 12 aswell as the thickness and shape of the albumen body 14 and the shelllayer 16. Thus thermal simulators 10 according to the invention may alsodepart significantly from the particular shape and size of an egg if itis not important that the simulator be compatible with egg processingequipment. In such cases, the thermal characteristics are paramount, andthe constraints on matching the physical size, shape and weight of anegg are lifted to achieve a simulator which provides data whichcorrelates well with eggs even if the simulator does not look like anegg.

Having a thermal simulator 10 with relevant characteristics of heatcapacity, density and thermal conductivity which yield a temperatureprofile within the yolk body 12 and albumen body 14 that closelyapproximates the temperature profile within an egg subject to the samethermal environment, it is necessary to measure the temperature profileand communicate the measurements so that an evaluation of the efficacyof the heat treatment process can be made, and or the process may bemonitored and controlled. As shown in FIG. 1, one or more thermometricdevices 22 may be positioned within the yolk body 12 and/or the albumenbody 14 to measure the temperature at one or more points within thesimulator 10. In its simplest form, one thermometric device 22 may bepositioned within the yolk body 12 to measure the temperature thereinand predict the temperature within eggs subject to the same heattreatment process. It may, however, be advantageous to position multiplethermometric devices 22 within the yolk body 12 and/or the albumen body14 as shown so that a more comprehensive temperature profile may beobtained. Thermometric devices 22 may comprise, for example,miniaturized temperature sensors including capacitive sensors,piezo-resistive sensors, vibration based sensors as well asthermocouples for measuring temperature. It is advantageous that thethermometric devices be as small as possible so as not to adverselyaffect the thermal or physical characteristics of the simulator 10.

Thermometric devices 22 are advantageously operatively associated withcommunication devices 24 in a combination device 26. An example of acombination device 26 comprising a thermometric device 22 andcommunication device 24 is shown in FIG. 2. The combination devicecomprises four main components: the temperature sensor (thermometricdevice 22), transduction and signal processing circuitry 28, radiofrequency antenna 30 and its associated transmission circuitry 32, andan energy storage unit 34. To make the combination device 26 as small aspossible microelectromechanical systems (MEMS) technology may be used.For example, the transduction circuitry 28, which performs the functionof transducing, filtering and amplifying signals from the temperaturesensor 22 may be formed on a CMOS chip. Similarly, the radiotransmission circuitry 32 may also be included in the CMOS chip. TheCMOS based circuitry 28 and 32 are integrated with the antenna 30 andthe temperature sensor 22, and all are powered by the energy storageunit 34. In this example the energy storage unit 34 comprises anelectrical battery or super capacitors which may be recharged fromoutside of the thermal simulator 10 inductively through the antenna. Inoperation, as shown in FIGS. 1 and 2, signals from the temperaturesensor 22 indicative of the temperature within the simulator 10 areprocessed by the transduction circuitry 28 and fed to the radiotransmission circuitry, which transmits the processed signals wirelesslyvia radio waves 36 to a computer 38 where the processed signals may bestored, displayed, and further manipulated to evaluate the process towhich the eggs are subjected.

FIG. 3 illustrates another example embodiment of a thermal simulator 40according to the invention. Simulator 40 comprises a yolk body 42,albumen body 44 and (optionally) a shell layer 46 substantially asdescribed above, but has a thermometric device 48 coupled to acommunication device 50 comprising electrical conductors extending to aposition outside of the thermal simulator 40. In this example thethermometric device 48, for example, a thermocouple, generateselectrical signals indicative of the temperature within the simulator40, and the signals are communicated over the electrical conductors 50(for example, wires) to external processing circuitry (not shown) fromwhence the processed signals may be further transmitted to a computerfor storage, display and further processing.

Although thermal simulators 10 and 40 for an egg have thus far beendescribed, the thermal simulator concept disclosed herein is not limitedto these examples, but may be extended to simulate other items almostwithout limit. FIG. 4 illustrates a generic thermal simulator 52 whichmay comprise a first body 54 having a thermometric device 56 and acommunication device 58 embedded therein. The thermometric device 56 andcommunication device 58 may be similar to those described above. Firstbody 54 is formed of a first material 60 having a first heat capacity, afirst density and a first thermal conductivity, the material 60 beingchosen and/or modified (for example by the addition of metal particles18 and/or ceramic particles 20) so that it simulates the characteristicsof a target item. for example, for certain applications it may befeasible to simulate a shell egg by a simulator having a single body 54which accurately represents the entire egg structure.

A multi-layer item may be simulated by surrounding first body 54 by asecond body 62. Second body 62 is formed of a second material 64 havinga second heat capacity, a second density and a second thermalconductivity, the second material 62 being chosen and/or modified (forexample by the addition of metal particles 18 and/or ceramic particles20) so that it simulates the characteristics of a particular layer ofthe target item. The second material 62 may be different from the firstmaterial 60 and any one, several, or all of its characteristics of heatcapacity, density and thermal conductivity may be different from thoseof the first material 60. Although the first and second bodies 54 and 62are shown in contact with one another, they need not be. The second body62 may also contain thermometric devices 56 and communication devices 58similar to those described above.

It is clearly feasible to simulate a multi-layer item by the addition offurther surrounding bodies. FIG. 4 shows the simulator embodiment 52having a third body 66 surrounding the second body 62. Third body 66 isformed of a third material 68 having a third heat capacity, a thirddensity and a third thermal conductivity, the third material 68 beingchosen and/or modified (for example by the addition of metal particles18 and/or ceramic particles 20) so that it simulates the characteristicsof a particular layer of the target item. The third material 68 may bedifferent from the first material 60 and the second material 64 and anyone, several, or all of its characteristics of heat capacity, densityand thermal conductivity may be different from those of the firstmaterial 60 and/or the second material 62. Although the second and thirdbodies 62 and 66 are shown in contact with one another, they need notbe. The third body may also contain thermometric devices 56 andcommunication devices 58 similar to those described above. Additionalbodies may be added as needed to practical limits.

While the thermal simulators thus far described are appropriate formodeling three dimensional bodies, the concept is further extendible to“two dimensional” items, i.e., items having a length and width which aresignificantly greater than their thickness. FIG. 5 illustrates anexample thermal simulator embodiment 70 suitable for modeling twodimensional items. Thermal simulator 70 may comprise a first substrate72 having one or more thermometric devices 74 and communication devices76 embedded therein. The thermometric device 74 and communication device76 may be similar to those described above. First substrate 72 is formedof a first material 78 having a first heat capacity, a first density anda first thermal conductivity, the first material 78 being chosen and/ormodified (for example by the addition of metal particles 18 and/orceramic particles 20) so that it simulates the characteristics of atarget two dimensional item. A multi-layer item may be simulated bypositioning a second substrate 80 overlying the first substrate 72.Second substrate 80 is formed of a second material 82 having a secondheat capacity, a second density and a second thermal conductivity, thesecond material 82 being chosen and/or modified (for example by theaddition of metal particles 18 and/or ceramic particles 20) so that itsimulates the characteristics of a particular layer of the target item.The second material 82 may be different from the first material 78 andany one, several, or all of its characteristics of heat capacity,density and thermal conductivity may be different from those of thefirst material 78. Although the first and second substrates 72 and 80are shown in contact with one another, they need not be. The secondsubstrate may also contain thermometric devices 74 and communicationdevices 76 similar to those described above.

It is clearly feasible to simulate a multi-layer item by the addition offurther substrates. FIG. 5 shows the thermal simulator embodiment 70having a third substrate 84 positioned overlying the second substrate80. Third substrate 84 is formed of a third material 86 having a thirdheat capacity, a third density and a third thermal conductivity, thematerial 86 being chosen and/or modified (for example by the addition ofmetal particles 18 and/or ceramic particles 20) so that it simulates thecharacteristics of a particular layer of the target item. The thirdmaterial 86 may be different from the first material 78 and the secondmaterial 82 and any one, several, or all of its characteristics of heatcapacity, density and thermal conductivity may be different from thoseof the first material 78 and/or the second material 82. Although thesecond and third substrates 80 and 84 are shown in contact with oneanother, they need not be. The third substrate 84 may also containthermometric devices 74 and communication devices 76 similar to thosedescribed above. Additional substrates may be added as needed topractical limits.

FIGS. 6-8 illustrate additional example thermal simulator embodiments.Thermal simulator 88, shown in FIG. 6, comprises a shell layer 90 whichdefines an enclosed volume 92. Shell layer 90 has an inner surface 94that faces the enclosed volume 92. A first thermometric device 22, and afirst communication device 24 are positioned within the enclosed volume92. The thermometric device measures a temperature and the communicationdevice transmits this measurement via radio waves to a position outsideof the shell layer 90 as described in detail above. In this example, asupport structure 96 is positioned between inner surface 94 and thethermometric device 22 for fixing its position within the enclosedvolume 92. In this example, the support structure comprises a strut 98that is rigidly attached to the shell layer 90 and the thermometricdevice 22. Strut 98 positions the thermometric device 22 at the centerof the enclosed volume 92 in this example, but it could be used toposition the device anywhere within the enclosed volume. The strut 98may be designed so that it conducts heat to the thermometric device at adesired rate so as to simulate the heat transfer characteristics of aparticular item. The design parameters which will allow the heattransfer characteristics of the strut to be adjusted include the length,the cross sectional area and the type of material. Through judiciouschoice of these parameters a wide range of heat transfer characteristicsmay be simulated. As also shown in FIG. 6, thermometric device 22 andcommunication device 24 may also be attached directly to the innersurface 94 of the shell layer 90.

FIG. 7 shows another example embodiment of a thermal simulator 100 whichuses a plurality of wires 102 as the support structure. Wires 102 extendfrom the shell layer 90 to the thermometric device 22 (and also thecommunication device 24) to suspend it at a desired position within theenclosed volume 92. Wires 102 may also be designed to transfer heat fromthe shell layer 90 to the thermometric device 22 at a desired rate,again by adjusting their characteristics such as length, cross sectionalarea and type of material.

Although wireless communication between the enclosed volume 92 and theambient is advantageous, it is also possible to use electricalconductors 104, as shown in example simulator 106 in FIG. 8, to transmittemperature measurements from the thermometric device 22. In thisexample embodiment, conductors 104 are designed so as to have nosignificant effect on the heat transfer from the ambient to thethermometric device, thereby maintaining the fidelity of the simulatorto its intended simulation.

The enclosed volume 92 in the various embodiments 88, 100 and 106affords another mechanism for control of the simulator's heat transfercharacteristics in that the volume may contain a gas 108 (for example,air) as shown in FIG. 6, a liquid 110, as shown in FIG. 7, or at least apartial vacuum 112 as shown in FIG. 8. The “filling” within the enclosedvolume 92 may be selected from many different gases, liquids andpressures so as to adjust the heat transfer properties of the simulatoras desired. It is advantageous to form the shell layer 90 and, incertain circumstances, the support structure 96 from inert materials,for example, polymers such as polypropylene, polystyrene andpolytetrafluoroethylene (Teflon).

Thermal simulators as described herein will permit temperaturemeasurements to be made which accurately and reliably reflect the actualtemperatures within items subjected to the same thermal environment asthe thermal simulator. Thermal simulators according to the invention areadvantageous when used to simulate items, such as eggs, which aredifficult to instrument and wherein it is difficult to make directmeasurements reliably and accurately.

What is claimed is:
 1. A thermal simulator, comprising: a first bodyformed of a first material, said first material having a first heatcapacity, a first density, and a first thermal conductivity; a firstthermometric device positioned within said first body; and a firstcommunication device for transmitting a first temperature, measuredwithin said first body by said first thermometric device, to a positionoutside of said first body.
 2. The thermal simulator according to claim1, wherein said first communication device comprises: transduction andsignal processing circuitry for converting a temperature measurementinto an electric signal; a radio frequency antenna and radio transmittercircuitry for transmitting said electric signal; and an energy storageunit for powering said circuitry.
 3. The thermal simulator according toclaim 1, wherein said first communication device comprises an electricalconductor extending from said first thermometric device through saidfirst body.
 4. The thermal simulator according to claim 1, wherein saidfirst thermometric devices comprises a sensor selected from the groupconsisting of capacitive sensors, piezo-resistive sensors, vibrationbased sensors and thermocouples.
 5. The thermal simulator according toclaim 1, further comprising: a second body surrounding said first body,said second body formed of a second material, said second materialhaving a second heat capacity, a second density, and a second thermalconductivity.
 6. The thermal simulator according to claim 5, furthercomprising a second thermometric device positioned within said secondbody; and a second communication device positioned within said secondbody for transmitting a second temperature, measured within said secondbody by said second thermometric device, to a position outside of saidsecond body.
 7. The thermal simulator according to claim 6, wherein saidsecond communication device comprises: transduction and signalprocessing circuitry for converting a temperature measurement into anelectric signal; a radio frequency antenna and radio transmittercircuitry for transmitting said electric signal; and an energy storageunit for powering said circuitry.
 8. The thermal simulator according toclaim 6, wherein said second communication device comprises anelectrical conductor extending from said second thermometric devicethrough said second body.
 9. The thermal simulator according to claim 5,wherein said first and second bodies are in contact with one another.10. The thermal simulator according to claim 5, wherein said secondmaterial is different from said first material.
 11. The thermalsimulator according to claim 5, wherein at least one of said second heatcapacity, said second density, and said second thermal conductivity isdifferent from said first heat capacity, said first density, and saidfirst thermal conductivity respectively.
 12. The thermal simulatoraccording to claim 5, further comprising: a third body surrounding saidsecond body, said third body formed of a third material, said thirdmaterial having a third heat capacity, a third density, and a thirdthermal conductivity.
 13. The thermal simulator according to claim 12,further comprising: a third thermometric device positioned within saidthird body; and a third communication device positioned within saidthird body for transmitting a third temperature, measured within saidthird body by said third thermometric device, to a position outside ofsaid third body.
 14. The thermal simulator according to claim 13,wherein said third communication device comprises: transduction andsignal processing circuitry for converting a temperature measurementinto an electric signal; a radio frequency antenna and radio transmittercircuitry for transmitting said electric signal; and an energy storageunit for powering said circuitry.
 15. The thermal simulator according toclaim 13, wherein said third communication device comprises anelectrical conductor extending from said third thermometric devicethrough said third body.
 16. The thermal simulator according to claim12, wherein said second and third bodies are in contact with oneanother.
 17. The thermal simulator according to claim 12, wherein saidthird material is different from said second material.
 18. The thermalsimulator according to claim 12, wherein at least one of said third heatcapacity, said third density, and said third thermal conductivity isdifferent from said second heat capacity, said second density, and saidsecond thermal conductivity respectively.
 19. A thermal simulator,comprising: a first substrate formed of a first material, said firstmaterial having a first heat capacity, a first density, and a firstthermal conductivity; a first thermometric device positioned within saidfirst substrate; and a first communication device positioned within saidfirst substrate for transmitting a first temperature, measured withinsaid first substrate by said first thermometric device, to a positionoutside of said first substrate.
 20. The thermal simulator according toclaim 19, wherein said first communication device comprises:transduction and signal processing circuitry for converting atemperature measurement into an electric signal; a radio frequencyantenna and radio transmitter circuitry for transmitting said electricsignal; and an energy storage unit for powering said circuitry.
 21. Thethermal simulator according to claim 19, wherein said firstcommunication device comprises an electrical conductor extending fromsaid first thermometric device through said first substrate.
 22. Thethermal simulator according to claim 19, wherein said first thermometricdevice comprises a capacitive sensor.
 23. The thermal simulatoraccording to claim 19, wherein said first thermometric device comprisesa thermocouple.
 24. The thermal simulator according to claim 19, furthercomprising: a second substrate overlying said first substrate, saidsecond substrate formed of a second material, said second materialhaving a second heat capacity, a second density, and a second thermalconductivity.
 25. The thermal simulator according to claim 24, furthercomprising: a second thermometric device positioned within said secondsubstrate; and a second communication device positioned within saidsecond substrate for transmitting a second temperature, measured withinsaid second substrate by said second thermometric device, to a positionoutside of said second substrate.
 26. The thermal simulator according toclaim 25, wherein said second communication device comprises:transduction and signal processing circuitry for converting atemperature measurement into an electric signal; a radio frequencyantenna and radio transmitter circuitry for transmitting said electricsignal; and an energy storage unit for powering said circuitry.
 27. Thethermal simulator according to claim 25, wherein said secondcommunication device comprises an electrical conductor extending fromsaid second thermometric device through said second substrate.
 28. Thethermal simulator according to claim 24, wherein said first and secondsubstrates are in contact with one another.
 29. The thermal simulatoraccording to claim 24, wherein said second material is different fromsaid first material.
 30. The thermal simulator according to claim 24,wherein at least one of said second heat capacity, said second density,and said second thermal conductivity is different from said first heatcapacity, said first density, and said first thermal conductivityrespectively.
 31. The thermal simulator according to claim 24, furthercomprising: a third substrate overlying said second substrate, saidthird substrate formed of a third material, said third material having athird heat capacity, a third density, and a third thermal conductivity.32. The thermal simulator according to claim 31, further comprising: athird thermometric device positioned within said third substrate; and athird communication device for transmitting a third temperature,measured within said third substrate by said third thermometric device,to a position outside of said third substrate.
 33. The thermal simulatoraccording to claim 32, wherein said third communication devicecomprises: transduction and signal processing circuitry for converting atemperature measurement into an electric signal; a radio frequencyantenna and radio transmitter circuitry for transmitting said electricsignal; and an energy storage unit for powering said circuitry.
 34. Thethermal simulator according to claim 32, wherein said thirdcommunication device comprises an electrical conductor extending fromsaid third thermometric device through said third substrate.
 35. Thethermal simulator according to claim 31, wherein said second and thirdsubstrates are in contact with one another.
 36. The thermal simulatoraccording to claim 31, wherein said third material is different fromsaid second material.
 37. The thermal simulator according to claim 31,wherein at least one of said third heat capacity, said third density,and said third thermal conductivity is different from said second heatcapacity, said second density, and said second thermal conductivityrespectively.
 38. A thermal simulator, comprising: a shell layerdefining an enclosed volume, said shell layer having an inner surfacefacing said enclosed volume; a first thermometric device positionedwithin said enclosed volume; a first communication device positionedwithin said enclosed volume for transmitting a first temperature,measured within said enclosed volume by said first thermometric device,to a position outside of said shell layer; and a support structurepositioned between said inner surface of said shell layer and said firstthermometric device for fixing said first thermometric device at adesired position within said enclosed volume.
 39. The thermal simulatoraccording to claim 38, wherein said first thermometric device ispositioned at a center of said enclosed volume.
 40. The thermalsimulator according to claim 38, further comprising: a secondthermometric device positioned within said enclosed volume; a secondcommunication device positioned within said enclosed volume fortransmitting a second temperature, measured within said enclosed volumeby said second thermometric device, to a position outside of said shelllayer; and wherein said second thermometric device is attached to saidinner surface of said shell layer.
 41. The thermal simulator accordingto claim 40, wherein at least one of said first and second communicationdevices comprises: transduction and signal processing circuitry forconverting a temperature measurement into an electric signal; a radiofrequency antenna and radio transmitter circuitry for transmitting saidelectric signal; and an energy storage unit for powering said circuitry.42. The thermal simulator according to claim 40, wherein at least one ofsaid first and second communication devices comprises an electricalconductor extending from said first thermometric device through saidshell layer.
 43. The thermal simulator according to claim 40, wherein atleast one of said first and second thermometric devices comprises asensor selected from the group consisting of capacitive sensors,piezo-resistive sensors, vibration based sensors and thermocouples. 44.The thermal simulator according to claim 38, wherein said enclosedvolume contains a gas.
 45. The thermal simulator according to claim 44,wherein said gas comprises air.
 46. The thermal simulator according toclaim 38, wherein said enclosed volume contains a liquid.
 47. Thethermal simulator according to claim 38, wherein said enclosed volumecomprises at least a partial vacuum.
 48. The thermal simulator accordingto claim 38, wherein said support structure comprises at least one strutextending between said inner surface and said first thermometric device.49. The thermal simulator according to claim 48, wherein said at leastone strut conducts heat from said shell layer to said first thermometricdevice at a desired rate.
 50. The thermal simulator according to claim38, wherein said support structure comprises a plurality of wiresextending between said shell layer and said first thermometric device,said wires being adapted to conduct heat from said shell to said firstthermometric device at a desire rate.